MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202414044277 A) filed by Carrier Corporation on June 07, 2024, for Server With Hybrid Thermal Management System.
Inventors include Joardar, Arindom; and Bushnell, Peter.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: A cooling system for cooling an assembly including at least one heat-generating electronic device includes a heat spreader thermally coupled to the at least one heatgenerating electronic device and a heat removal device having a surface that is thermally coupled to the at least one heat-generating electronic device via the heat spreader. The heat removal device includes an inlet area and at least one jet impingement feature fluidly coupled to the inlet area. The at least one jet impingement feature is positioned to direct a primary cooling fluid toward the surface that is thermally coupled to the at least one heat-generating electronic device.
Disclaimer: Curated by HT Syndication.
