MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202514103294 A) filed by Honeywell International Inc. on October 27, 2025, for Sensor Die.
Inventors include Beck, Scott Edward; Wang, Yong-Fa Alan; Foster, Philip C.; Pham, Thuy-Doan Thi; and Xu, Miao.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: Apparatuses, systems, and methods are provided for sensor dies, particularly silicon-based polymer sensor dies. A sensor die may be configured, via a plurality of interdigitated electrode (IDEs) and a sensing layer, to measure variations in impedance to detect presence of a material (e.g., a leakage from a battery). The sensor die may comprise a substrate comprised of a silicon oxide on silicon wafer, the plurality of IDEs (e.g., comprised of a metal) disposed proximate to a surface of the substrate, one or more retaining rings defining one or more regions therebetween configured to contain at least a volume of the material, and the sensing layer (e.g., comprised of solid polymer electrolyte (SPE)) disposed proximate to the plurality of IDEs.
Disclaimer: Curated by HT Syndication.
