MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202647122892 A) filed by Rapidus Corporation on October 14, 2026, for Semiconductor System And Method For Manufacturing Semiconductor System.
Inventor includes Nonaka Toshihisa.
The application for the patent was published on October 23, 2026, under issue no. 43/2026.
Abstract: Provided is a semiconductor system in which protrusion of resin from around a semiconductor chip is prevented and mounting freedom is high. In a semiconductor system (1), a substrate (50) and a semiconductor chip (20) are electrically connected via an electrode section (16) in a face-down manner, a space between the substrate (50) and the semiconductor chip (20) is filled with a resin section (14), and if a portion between the substrate (50) and the semiconductor chip (20) including the electrode section (16) and the resin section (14) serves as a connection section (10), an outer dimension of the connection section (10) in a cross section parallel to the substrate (50) is substantially the same at a portion contacting a chip connection surface 22 of the semiconductor chip (20) and a portion contacting the substrate (50).
Disclaimer: Curated by HT Syndication.
