MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202517066329 A) filed by Cxmt Corporation on July 11, 2025, for Semiconductor Device And Manufacturing Method Therefor.
Inventors include Lin, Chao; Liu, Ruisong; and Xu, Lihua.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: A semiconductor device and a manufacturing method therefor. The semiconductor device comprises: a substrate (100); common electrode structures (200) stacked on the substrate (100) in a first direction, the first direction intersecting the substrate (100); stacked array structures (20) comprising first electrode structures (300), the first electrode structures (300) being stacked on the substrate (100) along the first direction and electrically connected to the common electrode structures (200) arranged on the same layers; first lead-out structures (400) stacked in the first direction and connected to the common electrode structures (200) arranged on the same layers, each first lead-out structure (400) comprising a first lead (401) and a first dummy line (402) arranged opposingly, and in the first direction, the first leads (401) and the first dummy lines (402) of different first lead-out structures (400) being alternately arranged; and second lead-out structures (500) each comprising a second contact pad (501) and a second contact plug (502), each second contact pad (501) being arranged on the same layer as the corresponding first lead (401) and being electrically connected to the corresponding common electrode structure (200) by means of the corresponding first lead (401), the second contact plugs (502) being arranged on the second contact pads (501), and in the first direction, the second contact plugs (502) being staggered from each other.
Disclaimer: Curated by HT Syndication.
