MUMBAI, India, Sept. 14 -- Intellectual Property India has published a patent application (202641106167 A) filed by Amrita Vishwa Vidyapeetham on September 03, 2026, for Self-Healable Adhesive Hydrogel For Biomedical Applications And Method Of Preparation Thereof.
Inventors include Jayan, Jitha S; and Appukuttan, Saritha.
The application for the patent was published on September 11, 2026, under issue no. 37/2026.
Abstract: A self-healable adhesive hydrogel for biomedical applications and method of preparation thereof. The self-healable adhesive hydrogel includes lignin dispersed in an amphiphilic triblock copolymer (TBCP) matrix and an epoxy compound (EPC) associated with formation of a hydrogel network. The incorporation of lignin provides biological functionality to the hydrogel, including antibacterial activity, while the TBCP matrix imparts injectable and self-healing characteristics. Hydrogels containing different lignin loadings exhibit suitable rheological properties, injectability and recovery following mechanical deformation. The lignin-containing hydrogels demonstrate antibacterial activity against Escherichia coli, with improved antibacterial efficacy observed with increasing lignin content. Further, the hydrogels exhibit biocompatibility, cell compatibility and wound-healing capability as demonstrated through in-vitro and in-vivo evaluations. The hydrogel provides a multifunctional biomaterial for wound management, tissue regeneration and other biomedical applications. The method disclosed is scalable and cost-effective.
Disclaimer: Curated by HT Syndication.
