MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202641073692 A) filed by Manipal Academy Of Higher Education on June 13, 2026, for Secure Conductive Ink Formulation And Method Of Preparation Thereof.
Inventors include P J Anand; Dhanya Sunil; and Rakshitha K Jain.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: The present disclosure relates to a secure conductive ink formulation comprising 90–98 wt% of a conductive filler paste, 0.5–3 wt% of a DC green pigment concentrate, 0.8–2 wt% of a UC blue phosphorescent, and 1–2 wt% of a solvent. The present disclosure also provides a method for its preparation. The secure conductive ink formulation provides a latent signature intrinsically linked to the electrical functionality of printed circuits. When screen-printed to form components such as RFID tags or heater circuits, the ink enables multi-stage authentication via dual-wavelength excitation. The formulation exhibits green fluorescence under 365 nm ultraviolet light and blue emission under 980 nm near-infrared excitation, along with a photoacoustic signal detectable as an audible beep using an IR taggant reader. As the security features are embedded within the conductive matrix, replication without the specific formulation is highly difficult, enabling robust, non-destructive anti-counterfeiting verification.
Disclaimer: Curated by HT Syndication.
