MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202617074113 A) filed by Nichias Corporation on June 15, 2026, for Sealing Material.
Inventors include Aoyagi Hideharu; and Asanuma Shuji.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: Provided is a novel sealing material which exhibits excellent adhesion (sealing properties) at a low surface pressure. The sealing material is characterized by comprising an elastic layer including a foamed rubber layer and pressure-sensitive adhesive layers respectively disposed on both main surfaces of the elastic layer, and is further characterized in that: the foamed rubber layer is a foamed object formed from an unfoamed rubber layer comprising an ethylene/propylene/diene terpolymer (EPDM) which is a rubber component, a crosslinking agent, a crosslinking accelerator, and a blowing agent; and the crosslinking agent is a phenolic-resin crosslinking agent and the crosslinking accelerator is an organic sulfonic acid compound.
Disclaimer: Curated by HT Syndication.
