MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647077321 A) filed by Qualcomm Incorporated on June 23, 2026, for Scaffold Stiffener Embedded In Substrate.
Inventors include Bchir, Omar James; Rae, David Fraser; Seok, Jaewook; Noonan, Jill Christine Number; Kang, Kuiwon; and Buot, Joan Rey Villarba.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: In an aspect, an apparatus may include a package substrate including a metallization structure disposed in the package substrate. The metallization structure includes a plurality of conductive layers and a plurality of dielectric layers. The package substrate includes an embedded scaffold stiffener disposed on a perimeter of the metallization structure outside the metallization structure. The embedded scaffold stiffener includes a plurality of scaffold columns and a plurality of scaffold layers stacked vertically.
Disclaimer: Curated by HT Syndication.
