MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202541029249 A) filed by Jain Deemed-To-Be University on March 27, 2025, for Rubber Build-Up Removing Device For Airport Runways.
Inventor includes Dr. Adarsha H.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: A rubber build-up removing device for airport runways comprising of a platform 101 developed to be positioned over a ground surface and installed with multiple motorized omnidirectional wheels 102 arranged beneath the platform 101, an imaging unit 103 mounted on the platform 101 for detecting the presence of rubber over the runway, activates a heating unit 104 installed with a robotic arm 105 configured on the platform 101 for melting the rubber over the platform 101 for easy removal of the rubber, a wedge shaped plate 106 installed at one of lateral ends of the platform 101 and equipped with a sharp blade 107 at its end for scraping of the rubber layer, a robotic gripper 108 installed on the platform 101 and arranged with a rectangular member 109 for collecting and storing the scraped rubber from the runway into a storage container 110 arranged on the platform 101.
Disclaimer: Curated by HT Syndication.
