MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202517086594 A) filed by Bye Polymer Material Co. , Ltd on September 12, 2025, for Reusable High Shear Strength Electrical Debonding Tape And Preparation Method.
Inventors include Che, Rongsheng; and Yu, Sihai.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: The present invention relates to the technical field of adhesive materials, and specifically relates to a reusable high shear strength electrical debonding tape, and a preparation method. The tape is prepared using acrylate or olefin monomers, a methoxy polyethylene glycol-containing ester, acrylic acid, salts, functional monomers, an organic solvent, and a tackifying resin. In the electrical debonding tape of the present invention, most electrolytes are bonded to a main adhesive molecular chain through chemical bonds, and some electrolytes are dissociated and complexed by the strong ether-oxygen bonds of methoxy polyethylene glycol, rather than simple physical mixing as in the prior art, thus effectively preventing large-scale precipitation of electrolytes under electrified conditions, and enabling reuse.
Disclaimer: Curated by HT Syndication.
