MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202621095388 A) filed by Meril Corporation I Private Limited on August 06, 2026, for Reusable Heat Pack.
Inventors include Kothwala, Deveshkumar Mahendralal; Rana, Nirav Maheshbhai; Rana, Milankumar Hasmukhbhai; and Kabiria, Sumit Paresh.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: TITLE OF INVENTION: REUSABLE HEAT PACK A reusable heat pack (100) includes an enclosure (110), a gel (120), a mesh (130), an actuator disc (140), a conductive layer (150), and one or more pressure control modules (160). The gel (120) is disposed within the enclosure (110), the gel (120) being configured to generate heat by undergoing a phase change transition from a liquid state to a crystalline state. The mesh (130) is placed in the gel (120) and configured to facilitate uniform distribution of heat inside the enclosure (110). The actuator disc (140) is disposed within the gel (120) and configured to induce the phase transition of the gel (120) from the liquid state to the crystalline state. The conductive layer (150) is below the inner surface of the enclosure (110) and in contact with the gel (120). The one or more pressure control modules (160) are coupled to the enclosure (110). Fig. 1A
Disclaimer: Curated by HT Syndication.
