MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202641079399 A) filed by Manipal Academy Of Higher Education on June 27, 2026, for Resin Infusion Connector Device And Method For Facilitating Resin Transfer In Vacuum-Assisted Composite Manufacturing Process.
Inventors include Nagaraja Shetty; Krishna Kumar P; Madhav Sonkusare; and Sohan Kumar Y.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: Embodiments of the present disclosure relate to a resin infusion connector device (100) and method (200) for facilitating resin transfer in a vacuum-assisted composite manufacturing process. The device (100) includes a connector body, a resin inlet port (102), an internal chamber (104), a filtration assembly (110), an outlet interface (108) and a sealing portion (106). The internal chamber (104) is configured to reduce resin flow velocity and promote separation of entrained air bubbles from the resin stream. The filtration assembly (110) is disposed along resin flow path upstream of or within the internal chamber (104) and configured to remove one or more contaminants from the resin. The outlet interface (108) is disposed downstream of the internal chamber (104) and configured to convey conditioned resin to a resin distribution arrangement. The sealing portion (106) is associated with the connector body and configured to establish a sealed interface with a vacuum enclosure.
Disclaimer: Curated by HT Syndication.
