MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202617083020 A) filed by Namics Corporation on July 06, 2026, for Resin Composition, Adhesive Agent, Sealing Material, Cured Product, Semiconductor Device, And Electronic Component.
Inventors include Mitsunushi Koki; and Sato Ayako.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: The present invention addresses the problem of providing at least a thermosetting resin composition and an adhesive agent that can suppress the bleeding phenomenon. Provided is a resin composition comprising (A) a polymerizable compound having a carbon-carbon double bond, (B) a polythiol compound, (C) a polymerization initiator, and (D) a modified polydimethylsiloxane satisfying at least one of features (a) and (b): (a) an organic substituent group including a COOH group or an OH group is bound to a polydimethylsiloxane directly or via a linker; and (b) an 1H NMR spectrum measured in deuterated chloroform has signals in the ranges of 0.3 to - 0.3 ppm and 4.4-3.2 ppm, and has a signal that is in the range of 13 to 0 ppm and that disappears through the addition of D2O.
Disclaimer: Curated by HT Syndication.
