MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202647105120 A) filed by Xiamen Hongfa Electric Power Controls Co. , Ltd. on September 01, 2026, for Relay.
Inventors include Dai, Wenguang; Wu, Zhuxiong; Zhong, Shuming; and Chen, Songsheng.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: The present application relates to a relay, comprising an insulating cover, a pair of static contacts, and a movable contact blade, wherein the insulating cover is provided with an inner cavity, and the insulating cover is further provided with a pair of mounting holes communicated with the inner cavity; each static contact is provided with an extending part, a connecting part, and a contact part, the extending part is connected to the contact part by means of the connecting part, two connecting parts respectively pass through the pair of mounting holes, and the extending parts are located on the outer surface of the insulating cover and connected to the insulating cover; the contact parts are located in the inner cavity and provided with static contact parts; the movable contact blade is provided with movable contact parts corresponding to the static contact parts; the respective orthographic projections of the movable contact parts and the static contact parts on a target plane have overlapping first projections, the orthographic projections of the connecting parts on the target plane are second projections, and at least parts of the first projections fall outside the second projections; the target plane is perpendicular to the moving direction of the moving contact blade.
Disclaimer: Curated by HT Syndication.
