MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202647103951 A) filed by Xiamen Hongfa Electric Power Controls Co. , Ltd. on August 28, 2026, for Relay.
Inventors include Su, Liji; Wu, Zhuxiong; Dai, Wenguang; and Zhong, Shuming.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: The present application discloses a relay, comprising a pair of static contacts (22), a movable contact assembly (30a) and an anti-short-circuit structure (50). Two ends of the movable contact assembly (30a) in the length direction are used for being in contact with the pair of static contacts (22) respectively; the movable contact assembly (30a) comprises a plurality of movable branch parts (311); the anti-short-circuit structure (50) comprises first magnetizers (51) and connecting parts (53), the first magnetizers (51) are arranged on the side of the movable contact assembly (30a) facing the static contacts (22), the first magnetizers (51) are provided with a plurality of magnetically conductive parts (512) arranged at intervals, and the connecting parts (53) are connected to each two adjacent magnetically conductive parts (512); and in the movement direction of the movable contact assembly (30a), there are corresponding movable branch parts (311) and magnetically conductive parts (512) among the plurality of movable branch parts (311) and the plurality of magnetically conductive parts (512), and the orthographic projections of the corresponding magnetically conductive parts (512) and movable branch parts (311) on a target plane have an overlapping area, the target plane being perpendicular to the movement direction of the movable contact assembly (30a).
Disclaimer: Curated by HT Syndication.
