MUMBAI, India, Sept. 7 -- Intellectual Property India has published a patent application (202617084949 A) filed by International Business Machines Corporation on July 10, 2026, for Redressing A Chip Site On A Multi-Chip Laminate Package.
Inventors include Farooq, Mukta, Ghate; Jain, Aakrati; Raghavan, Sathyanarayanan; and Roy Chowdhury, Prabudhya.
The application for the patent was published on September 04, 2026, under issue no. 36/2026.
Abstract: A method and apparatus extracts solder from a redress site of multiple chips on a laminate structure. The method includes depositing conductive pads on a flexible insulating film with a same pitch as solder bumps on a laminate structure that are to be extracted. The flexible film is mounted on a retaining surface, and the conductive pads are heated at a temperature above a solder melting temperature. The retaining surface descends toward a laminate having solder thereon until the heated conductive pads come into contact with at least one solder bump. The retaining surface is retracted from contact and includes most of the at least one contacted solder bump that was on the laminate structure. The operations repeat until the solder remaining on die pads on the laminate is similar to an amount of initially arranged pre-solder.
Disclaimer: Curated by HT Syndication.
