MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202418063462 A) filed by Amcor Flexibles North America, Inc. on August 22, 2024, for Recyclable Film For Thermoforming.
Inventors include Priscal, Michael, D.; and Lasee, Jacob, A..
The application for the patent was published on July 17, 2026, under issue no. 29/2026.
Abstract: Recyclable films having a first layer containing a polyethylene, a second layer containing a high-density polyethylene and a hydrocarbon resin, and a third layer containing a polyethylene may be used for thermoforming packaging components. Both the first and third layers have an overall density between about 0.92 g/cm3 and 0.97 g/cm3. The film structure is advantageous as it can be more easily thermoformed than traditional high-density polyethylene films and can maintain the shape taken during thermoforming, exhibiting minimal warping or shrinking.
Disclaimer: Curated by HT Syndication.
