MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202621073273 A) filed by Meril Medical Innovations Private Limited on June 12, 2026, for Radiofrequency Transseptal Needle Assembly And Method Of Assembling.
Inventors include Kothwala, Deveshkumar Mahendralal; Shaikh, Amirhamzah Mahmadiqbal; Khalifa, Haroonmohammad Rasidmohammad; Bhavsar, Girakumari Rajubhai; and Kansara, Sagar Dineshchandra.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: A radiofrequency transseptal needle assembly (100, 200) includes a needle shaft (102, 208) having a distal end (106) and a hollow lumen (108). The distal end (106) includes a mechanical engagement feature (110, 210) on an outer surface. A radiofrequency tip electrode (116, 212) includes an internal bore (118) having a corresponding engagement feature (120, 214) configured to mate with the mechanical engagement feature (110, 210). A conductor (114) extends through the hollow lumen (108) and is electrically connected to the radiofrequency tip electrode (116, 212) for radiofrequency energy transmission. The mechanical engagement feature (110, 210) engages with the corresponding engagement feature (120, 214) to secure the radiofrequency tip electrode (116, 212) to the distal end (106) of the needle shaft (102, 208) through a positive mechanical interlock that retains the radiofrequency tip electrode (116, 212) against axial displacement and rotational loosening. FIG. 1A
Disclaimer: Curated by HT Syndication.
