MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202521023779 A) filed by Meril Corporation I Private Limited on March 18, 2025, for Profile Constrained Assembly For Mobile Orthopaedic Implant.
Inventors include Patel, Bhavik R; Kv, Latheesh; Patel, Vyom; Shah, Naman; and Patel, Siddharth.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: Disclosed is a profile constrained assembly (100) for mobile orthopaedic implant. Profile constrained assembly comprises modular shell component (102) adapted to engage with first part of mobile orthopaedic implant and comprising first surface (202) , second surface (204), first internal volume (206); modular liner component (104) to be accommodated within modular shell component, and comprising third surface (214), fourth surface (216) comprising proximal entry region (218), distal profile region (220), and conjunction region (222) positioned therebetween, and second internal volume (226); and modular head component (106) to be accommodated within modular liner component via the proximal entry region, for relative sliding movement therein, modular head component comprises fifth surface (232) comprising insertion slot (234) for accommodating second part of mobile orthopaedic implant, and protrusion (236) adapted to be received in distal profile region.
Disclaimer: Curated by HT Syndication.
