MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202617068573 A) filed by Uop LLC on June 01, 2026, for Processes And Apparatuses For Supporting Conduits In A Radial Flow Reactor.
Inventors include Lok, Ka L.; Duncan, William B.; and Meyer, Joshua.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: An apparatus for supporting conduits in a radial flow reactor. A support plate rests on an internal surface of the reactor below a cylindrical wall of the reactor. Lugs are connected to the support plate and a support ring is supported by the lugs. The conduits are supported by the support ring. Stabilizing plates may be utilized. Also a process of installing such a supporting apparatus in a reactor.
Disclaimer: Curated by HT Syndication.
