MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202647114316 A) filed by Henkel AG & Co. Kgaa on September 24, 2026, for Process And System For Manufacturing An Antenna Split In An Electrically-Conductive Casing Part Of An Electronic Device.
Inventors include Wu, Wenzhang; Lou, Kangcheng; Lin, Yubin; Zhou, Jia; Meng, Yun; and Tao, Fangqi.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: The present disclosure generally relates to a process and a system for manufacturing an antenna split in an electrically-conductive casing part of an electronic device, which process comprises: preparing and providing a mold formed with an injection port; at least partially placing the electrically-conductive casing part of the electronic device provided with at least one open-split into the mold and hold the casing part in the mold; injecting a liquid glue made of epoxy or polyurethane into the open-split through the injection port of the mold; vibrating or shaking the mold for a given period; heating the mold such that the glue is cured as the antenna split in the casing part; and removing the electrically-conductive casing part with the antenna split from the mold.
Disclaimer: Curated by HT Syndication.
