MUMBAI, India, June 22 -- Intellectual Property India has published a patent application (202631012206 A) filed by Ekokul Pvt. Ltd. on February 04, 2026, for Prefabricated Integrated Thermal Insulation Board.
Inventor includes Mr. Kausikbrata Maiti.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: Prefabricated integrated thermal insulation board The present invention relates to a prefabricated, unitary integrated polymeric composite thermal-insulation board and a method for manufacturing the same. The insulation board comprises an insulating core including expanded polystyrene (EPS) foam, an expandable polymer matrix formed by a two-component hard rigid polyurethane foam, a first substrate layer containing recycled single-use plastic particles, and a second substrate layer containing virgin or used EPS particles. The layers are integrally bonded through self-adhesion during polyurethane curing to form a monolithic structure without the use of external adhesive mortars, mechanical fasteners, or reinforcing meshes. Fire-retardant and vapour-resistant additives are intrinsically incorporated, and an optional surface finishing layer provides durability and aesthetics. The board exhibits enhanced thermal insulation, compressive strength, dimensional stability, fire resistance, and moisture resistance while enabling utilization of recycled plastic waste. The invention is suitable for walls, roofs, floors, prefabricated panels, cold storage facilities, insulated containers, and cold-chain logistics, and allows rapid installation with reduced labour and improved long-term performance.
Disclaimer: Curated by HT Syndication.
