MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202641115863 A) filed by Vellore Institute Of Technology on September 28, 2026, for Predictive Hotspot-Aware Reconfigurable Microfluidic Cooling System For High-Density Ai Accelerator Dies.
Inventors include Srivasthsava M; Shaik Roohi Naaz; and Jayakumaran U.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: The present invention relates to a predictive and spatially reconfigurable liquid-cooling system for a high-density AI accelerator 101. The system comprises a Prediction & Control Unit 102, Valve Driver 103, Sensor Module 104, Reconfigurable Microfluidic Cooling Layer 105 having an electrowetting-actuated valve array, and Coolant Loop 106. Workload telemetry generated by the AI accelerator 101, together with thermal and hydraulic measurements from the Sensor Module 104, is processed to predict future thermal hotspots and generate an anticipated thermal map. The Prediction & Control Unit 102 controls the Valve Driver 103 to selectively reconfigure coolant-flow paths and direct coolant toward present or predicted hotspot regions before critical temperature conditions occur. A deterministic hardware control path provides low-latency thermal response independently of predictive processing. The system further supports digital-twin-based optimization, hydraulic self-diagnostics, redundant cooling paths, peristaltic electrowetting pumping, and IoT/Edge Gateway 107 communication with a Remote Platform 108 for monitoring and predictive maintenance.
Disclaimer: Curated by HT Syndication.
