MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202614019184 A) filed by Sig Services AG on February 19, 2026, for Pouch Comprising A Film With A Layered Structure And Method For Producing The Same.
Inventors include Uribe Soto, Luis Fernando; Perini Bortolo, Otvio; and Santini Torres, Luis Alberto.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: A container for accommodating a product, wherein the container comprises a. an interior volume, b. a first sidewall comprising a film, wherein the film comprises a layered structure, wherein a cross-sectional cut of the film comprises at least five layers, wherein the at least five layers are arranged in A.] a layered sub-structure A comprising at least two layers, B.] a layered sub-structure B comprising at least one layer, and C.] a layered sub-structure C comprising at least two layers, wherein I. the layered sub-structure B is arranged between the layered sub-structure A and the lay-ered sub-structure C, and II. the layered sub-structure C is arranged closer to the interior volume of the container com-pared to the layered sub-structure A; wherein a thickness A of the layered sub-structure A is less than or equal to a thickness C of the layered sub-structure C
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