MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202641075319 A) filed by Nitte Deemed To Be University; Dr. Aditya Shetty; Dr. Lakshmi Nidhi Rao; and Dr Boya Tejaswi Naidu on June 18, 2026, for Polymeric Resin Matrix Composition For Pit And Fissure Sealing.
Inventors include Dr. Aditya Shetty; Dr. Lakshmi Nidhi Rao; and Dr Boya Tejaswi Naidu.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: ABSTRACT Disclosed herein is a polymeric resin matrix composition for pit and fissure sealing (100) comprises a plurality of resin-forming monomers (102) in a pre- defined quantity with polymerizable and film-forming properties for application to a tooth surface. The composition further comprises polydopamine (104) in a pre- defined quantity with adhesive and interfacial bonding properties and also comprises polydopamine and a dopamine precursor capable of in-situ polymerization. A zwitterionic material (106) is included in a pre-defined quantity with antifouling and protein-repellent properties for resisting bacterial adhesion. A photoinitiator (108) is present in a pre-defined quantity with light-activated polymerization properties. A solvent (110) is then incorporated in a pre-defined quantity with viscosity- regulating and penetration-enhancing properties. The composition further comprises a homogeneously dispersed phase (112) which is obtained through mechanical mixing and grinding for distributing the polydopamine (104) and the zwitterionic material (106) within resin matrix (102), thereby improving adhesion, sealing performance, and durability.
Disclaimer: Curated by HT Syndication.
