MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202617091234 A) filed by Dow Global Technologies LLC on July 27, 2026, for Polymeric Compositions And Coated Conductors Made Therefrom.
Inventors include Esseghir, Mohamed; Xu, Xianmin; and Ma, Wanfu.
The application for the patent was published on October 23, 2026, under issue no. 43/2026.
Abstract: A polymeric composition includes 60 wt% to 85 wt% of a first ethylene-based polymer, wherein the first ethylene-based polymer has a density of 0.93 g/cc to 0.97 g/cc as measured according to ASTM D792 and has a polydispersity index of 7 or greater as measured according to Gel Permeation Chromatography and has a shear viscosity v100 of 800 Pa. s or greater at 170? as measured according to dynamic mechanical spectroscopy; 15 wt% to 40 wt% of a second ethylene-based polymer, wherein the second ethylene-based polymer has a density of 0.916 g/cc to 0.930 g/cc as measured according to ASTM D792 and has a shear viscosity v100 of 800 Pa. s or greater at 170? as measured according to Dynamic Mechanical Spectroscopy; and 0.1 wt% to 2.0 wt% of a foaming agent based on the total weight of the polymeric composition.
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