MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202617083430 A) filed by Arkema France on July 07, 2026, for Polyamide Element For Cooling Circuits Using At Least One Dielectric Fluid.
Inventors include Prenveille, Thomas; Burel, Antoine; Fernagut, Franois; and Vautier, Sbastien.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: The invention relates to the use of at least one element in a cooling circuit using at least one dielectric fluid, wherein: the element comprises at least one layer consisting of a composition C, characterised in that: - the composition C comprises from 50 to 99.9% by weight, relative to the total weight of the composition, of a polyamide matrix having an average C/N ratio of greater than or equal to 7, and is free of fibres and reinforcing fillers; - the dielectric fluid is liquid at atmospheric pressure at 23°C and comprises less than 10% by weight of water and glycol ether; and - the layer is intended to be in contact with the dielectric fluid.
Disclaimer: Curated by HT Syndication.
