MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202617044399 A) filed by Elantas North America, LLC on April 07, 2026, for Poly(vinylformal) Based Resin And The Use Thereof For Coating Wires.
Inventors include Murray, Thomas; and Vines, David.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: The present invention relates to a composition comprising: a poly(vinylformal) resin; an aromatic diol compound; an aromatic or aliphatic epoxy compound; a catalyst for the reaction between the aromatic diol compound and the aromatic or aliphatic epoxy compound; a crosslinker for reacting the poly(vinylformal) resin with the reaction product obtained by reacting the aromatic diol compound with the aromatic or aliphatic epoxy compound. This composition can be used as a wire enamel.
Disclaimer: Curated by HT Syndication.
