MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202531030286 A) filed by Siksha O Anusandhan Deemed To Be University on March 28, 2025, for Pipe Joint Bonding Assistive Device.
Inventor includes Dr. Lasyamayee Garanayak.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: A pipe joint bonding assistive device comprises of, a platform 101 configured to be positioned on one of a pair of metal pipes to be joined, a plurality of suction cups 102 is arranged on a lower portion of platform 101 for securing platform 101, a microphone 103 installed in platform 101 that is accessed by a user for providing input voice commands, an imaging unit 104 paired with a processor integrated in platform 101 for capturing and processing multiple images in vicinity of platform 101, a L- shaped pole 106 extends to position nozzle 105 over joint to dispense a rosin flux stored in a chamber 107, a motorized brush 108 installed as a bifurcation to pole 106 for rubbing flux around joint and a U-shaped clamp 109 installed on platform 101 via an extendable L-shaped rod 110 that for positioning clamp 109 around joint.
Disclaimer: Curated by HT Syndication.
