MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202548111473 A) filed by Qualcomm Incorporated on November 14, 2025, for Physical Layer Preamble And Signaling For Wireless Communication.
Inventors include Chen, Jialing Li; Vermani, Sameer; Yang, Lin Number; Tian, Bin; Jones, Iv, Vincent Knowles; and Kim, Youhan Filed On.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: ABSTRACT PHYSICAL LAYER PREAMBLE AND SIGNALING FOR WIRELESS COMMUNICATION This disclosure provides methods, devices and systems for wireless communication, and particularly, methods, devices and systems for including signaling regarding enhanced features of new wireless communication protocols. The signaling may be included in various portions of a physical layer preamble of a wireless transmission. In some implementations, the physical layer preamble may be used to indicate puncturing of subbands or content channels that may carry further signaling in accordance with preamble signaling designs of this disclosure. The physical layer preamble signaling be parallelized for different subchannels of a wireless channel that consists of multiple subchannels. Some implementations of the physical layer preambles may be used to multiplex different types of wireless local area network communications into different subsets of the plurality of subchannels of the wireless channel
Disclaimer: Curated by HT Syndication.
