MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088704 A) filed by Qualcomm Incorporated on July 21, 2026, for Package Substrate.
Inventors include Kang, Kuiwon; Bchir, Omar James; We, Hong Bok; and Choi, Seongryul.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: Disclosed are techniques for a structure of a package substrate. In an aspect, a package substrate includes a core dielectric that includes a first surface, a second surface, and a first cavity through the core dielectric. The EPS structure includes a first metallization structure on the first surface of the core dielectric and a second metallization structure on the second surface of the core dielectric. The first metallization structure includes a first plurality of dielectric layers, and the second metallization structure includes a second plurality of dielectric layers. The EPS structure further includes a first embedded component disposed in the first cavity and through at least the core dielectric, one of the first plurality of dielectric layers immediately adjacent the first surface of the core dielectric, and one of the second plurality of dielectric layers immediately adjacent the second surface of the core dielectric.
Disclaimer: Curated by HT Syndication.
