MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202647058815 A) filed by Qualcomm Incorporated on May 08, 2026, for Package Substrate With Embedded Capacitor Package Having Redistribution Layer(s) (rdl(s)) For Aligning Capacitor Terminals Connections To Semiconductor Die In An Integrated Circuit (ic) Package, And Related Fabrication Methods.
Inventors include Patil, Aniket; Buot, Joan Rey Villarba; and Gupta, Piyush.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: Package substrate with embedded capacitor package with a redistribution layer(s) (RDL(s)) for aligning capacitor terminals to die interconnects of a semiconductor die ("die") in an integrated circuit (IC) package, and related IC packages and fabrication methods. The capacitor package can be embedded in a package substrate of an IC package, such as to provide a decoupling capacitance or filter for a die of the IC package. A RDL(s) is built on a substrate of a capacitor of the capacitor package such that RDL interconnects of the RDL(s) are coupled to capacitor terminals of the capacitor. The RDL(s) redistributes connections to the capacitor terminals of the capacitor, to a desired pattern and/or pitch to align the capacitor terminals with die interconnects of a die coupled to the package substrate of the IC package. This minimizes signal path length between the capacitor and die to minimize inductance in the capacitive loop.
Disclaimer: Curated by HT Syndication.
