MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088350 A) filed by Qualcomm Incorporated on July 20, 2026, for Package Substrate Having Stacked Electronic Component Structure Disposed In A Cavity Of A Core.
Inventors include Chen, Yujen; Patil, Aniket; and Sun, Yangyang.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: In an aspect, a substrate includes a core having a cavity; a first set of one or more metallization layers disposed at an upper portion of the core; and a stacked electronic component structure disposed in the cavity, wherein the stacked electronic component structure comprises a first electronic component including an upper surface having a second set of one or more metallization layers and a first set of via structures electrically coupling the first electronic component with the first set of one or more metallization layers, and a second electronic component over the first electronic, the second electronic component including an upper surface having a third set of one or more metallization layers electrically coupling the second electronic component with the first set of one or more first metallization layers.
Disclaimer: Curated by HT Syndication.
