Intellectual Property India Publishes Patent Application for Package Comprising Substrates, Integrated Devices And A Heat Sink

MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088780 A) filed by Qualcomm Incorporated on July 21, 2026, for Package Comprising Substrates, Integrated Devices And A Heat Sink.

Inventors include Li, Yue; Yu, Youmin; Lane, Ryan; Gupta, Piyush; and Wu, Wei.

The application for the patent was published on July 24, 2026, under issue no. 30/2026.

Abstract: A package comprising a first substrate; a first integrated device coupled to the first substrate; a second substrate; a second integrated device coupled to the second substrate; and a heat sink coupled to the second substrate, wherein the heat sink vertically overlaps with at least part of the first integrated device, and wherein the heat sink is located laterally to the second integrated device.

Disclaimer: Curated by HT Syndication.