MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202647094714 A) filed by Qualcomm Incorporated on August 05, 2026, for Package Comprising An Interposer Package With Metallization Portions, And A Passive Device And A Bridge Between The Metallization Portions.
Inventors include Song, Yanmei; Stone, William; and Lane, Ryan.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: A package comprising a first integrated device; a second integrated device; and a package interposer coupled to the first integrated device and the second integrated device. The package interposer comprises a first metallization portion; a second metallization portion; a first encapsulation layer coupled to the first metallization portion and the second metallization portion; and a passive device located at least partially in the first encapsulation layer. The first encapsulation layer and the passive device are located between the first metallization portion and the second metallization portion.
Disclaimer: Curated by HT Syndication.
