MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647077312 A) filed by Qualcomm Incorporated on June 23, 2026, for Package Comprising A Base Portion And Integrated Devices.
Inventors include Sun, Yangyang; Hu, Wei; and Zhao, Lily.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: A package comprising a base portion comprising a plurality of base interconnects; a first integrated device coupled to the base portion; a second integrated device coupled to the base portion; a fill material coupled to the base portion, the first integrated device and the second integrated device; and a metallization portion coupled to the first integrated device and the second integrated device.
Disclaimer: Curated by HT Syndication.
