MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202617073112 A) filed by Versah, LLC on June 12, 2026, for Osseodensification Bur With Tip Relief And Method Of Use.
Inventor includes Huwais, Salah.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: A rotary tool configured for high-speed condensing and/or cutting action to enlarge a hole. The tool has a body around which is formed a plurality of flutes. Each flute has a cutting face on one side and a densifying face on the other side. A land between adjacent flutes establishes a substantially margin-less working edge along each cutting face. The working edges are configured to produce osseodensification when the tool is operated in the condensing mode. A transverse valley is formed at the apical end of the body. The valley is a relief in the tip that creates several secondary cut/grind edges that are useful to produce and evenly distribute bone debris. When withdrawing the rotary osteotome from an enlarged hole, a small button of bone debris remains at the button of the hole. The button remnant facilitates new bone ingrowth and osseointegration of a subsequently installed anchor.
Disclaimer: Curated by HT Syndication.
