MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202631069065 A) filed by C. V. Raman Global University on June 02, 2026, for Orbital Wire-Arc Additive Manufacturing (waam) Unit For Direct Conversion Of Captured Metallic Debris”.
Inventors include Debankur Pal B; Sayan Pal; Siba Kumar Pujari; and Smita Rani Parija.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: The present invention relates to an Orbital Wire-Arc Additive Manufacturing (WAAM) Unit for Direct Conversion of Captured Metallic Debris. The invention provides an integrated spacedeployable manufacturing platform capable of capturing metallic orbital debris, processing the recovered material, generating standardized wire feedstock, and fabricating functional components directly in orbit. The system includes a debris capture module, cleaning and processing subsystem, melting chamber, wire extrusion unit, WAAM deposition module, robotic motion platform, thermal management system, sensor network, and closed-loop control architecture. Captured debris is transformed into reusable manufacturing material without requiring return to Earth. The generated wire feedstock is deposited layer by layer using a controlled electric arc process to produce structural, mechanical, and replacement components. Real-time monitoring and feedback control ensure manufacturing stability under microgravity and vacuum conditions. The invention reduces launch mass requirements, minimizes dependence on Earth-based supply chains, supports on-demand manufacturing, and contributes to orbital debris mitigation. The disclosed system establishes a sustainable closed-loop orbital manufacturing ecosystem for future satellites, space stations, and deep-space missions.
Disclaimer: Curated by HT Syndication.
