MUMBAI, India, Sept. 14 -- Intellectual Property India has published a patent application (202611086597 A) filed by Maharishi Markandeshwar Deemed To Be University on July 15, 2026, for Optimized Multigrain Gluten-Free Noodle Composition With Mechanical Binder-Free Structuring Process.
Inventors include Sukriti Singh; Mrs Suman Rajput; and Palak Banga.
The application for the patent was published on September 11, 2026, under issue no. 37/2026.
Abstract: The present invention relates to an optimized multigrain gluten-free noodle composition and a mechanical binder-free structuring process for preparing gluten-free noodles. The composition comprises soybean flour (45%), chickpea flour (45%), and sorghum flour (10%), wherein the dough is subjected to repeated folding, turning, and spinning for about 15–20 cycles to develop a cohesive viscoelastic network without the use of gluten, synthetic binders, or chemical additives. The resulting noodles exhibit improved nutritional quality, enhanced texture, superior cooking stability, and a shelf life of up to 90 days under laminated packaging.
Disclaimer: Curated by HT Syndication.
