MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202647065821 A) filed by Henkel AG & Co. Kgaa on May 25, 2026, for One Component Composition Based On Epoxy Resins.
Inventors include Benomar, Mustapha; Klotz, Michael; Okuno Mattice, Hiroko; Kumar, Girdhari; and Ohkubo, Makoto.
The application for the patent was published on June 05, 2026, under issue no. 23/2026.
Abstract: An one component (1K) curable composition comprising, based on the weight of the composition: from 50 to 90 wt.% of a) at least one epoxy resin which has been modified with a hydrophobic elastomer, said modified epoxy resin having an epoxide equivalent weight of from 200 to 1000 g/eq; from 2 to 25 wt.% of b) at least one epoxy resin distinct from the modified resin of part a); c) at least one compound which provides at least two amine hydrogens reactive toward epoxide groups; and, from 0.01 to 5 wt.% of d) at least one accelerator, wherein the composition preferably is characterized by a molar ratio of epoxide groups to epoxide-reactive groups (ER) of 0.7:1 ER = 3:1.
Disclaimer: Curated by HT Syndication.
