MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202647065628 A) filed by Henkel AG & Co. Kgaa on May 25, 2026, for One Component Composition Based On Epoxy Resins.
Inventors include Benomar, Mustapha; and Klotz, Michael.
The application for the patent was published on June 05, 2026, under issue no. 23/2026.
Abstract: The present disclosure is directed to an one-component (1K) curable composition comprising, based on the weight of the composition: from 50 to 90 wt.% of a) at least one epoxy resin which has been modified with a hydrophobic elastomer, said modified epoxy resin having an epoxide equivalent weight of from 200 to 1000 g/eq; up to 15 wt.% of b) at least one epoxy resin distinct from the modified resin of part a); c) at least one compound which provides at least two amine hydrogens reactive toward epoxide groups; and, from 0.01 to 5 wt.% of d) at least one accelerator, wherein the composition is characterized by a molar ratio of epoxide groups to epoxide-reactive groups of from 0.5:1 to 1.4:1.
Disclaimer: Curated by HT Syndication.
