MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202541039530 A) filed by Ciena Corporation on April 24, 2025, for Narrow And Elongated Anti-Pad For High-Speed Serdes Vias.
Inventors include Mukul Tripathi; Rampratap Mahawar; Krishan Kant Verma; Prem Singh; and Ujjwal Tripathi.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: A signal transition structure (300) includes a via (202) extending through a printed circuit board (PCB) substrate, the via defining a via pitch (a) and a via center (203); and an anti-pad (201) disposed about the via (202), the anti-pad (201) including an elongated geometry defining a length, a width narrower than the length, and at least one semicircular end (204), wherein a center of the semicircular end (204) is offset from the via center (203) by a displacement (d) distance greater than zero, the elongated geometry is configured such that the length (l) is a sum of the via pitch and two times the sum of a radius of the semicircular end (204) and the displacement distance (b). FIG. 3
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