MUMBAI, India, Sept. 7 -- Intellectual Property India has published a patent application (202641104469 A) filed by Renjith Thomas; St. Joseph'S College Of Engineering And Technology; Rajesh Baby; and Girinath Bala on August 31, 2026, for Multi-Zone Pcm Laptop Cooling Pad With Expansion-Tolerant Encapsulation And Adaptive Thermal- Regeneration Control.
Inventors include Renjith Thomas; Rajesh Baby; and Girinath Bala.
The application for the patent was published on September 04, 2026, under issue no. 36/2026.
Abstract: The present invention relates to a multi-zone phase change material (PCM) based thermal-management system for cooling a laptop or portable electronic device. The system comprises a thermally conductive support arrangement configured to receive heat generated by the device and transfer the heat toward a plurality of PCM chambers. The PCM chambers contain thermally differentiated PCM materials having different phase-transition characteristics, thereby providing successive stages of thermal-energy absorption over different temperature ranges. The system further incorporates a controlled heat-transfer structure and heat-transfer fins for distributing and dissipating thermal energy. The invention further provides an expansion-tolerant PCM containment arrangement configured to accommodate volumetric changes of the PCM during repeated melting and solidification cycles. A temperature-sensing and control arrangement selectively operates a cooling fan according to the sensed thermal condition to dissipate stored thermal energy and facilitate PCM regeneration. Accordingly, the invention provides staged heat absorption, extended thermal buffering, controlled heat dissipation and repeatable thermal regeneration in a reusable cooling arrangement for laptops and portable electronic devices.
Disclaimer: Curated by HT Syndication.
