Intellectual Property India Publishes Patent Application for Multi-Axis Laser Machining Apparatus And Operation Method Thereof

MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202631098097 A) filed by Jashaswi Supriya Satpathy; Binay Sahoo; Sudhansu Sekhar Sahoo; Kamal Pal; Prasanta Kumar Satapathy; Abhijit Mohanty; Shree Roy; and Dishant Kumar Mohanty on August 13, 2026, for Multi-Axis Laser Machining Apparatus And Operation Method Thereof.

Inventors include Jashaswi Supriya Satpathy; Binay Sahoo; Sudhansu Sekhar Sahoo; Kamal Pal; Prasanta Kumar Satapathy; Abhijit Mohanty; Shree Roy; and Dishant Kumar Mohanty.

The application for the patent was published on September 18, 2026, under issue no. 38/2026.

Abstract: Disclosed herein is a multi-axis laser machining apparatus for performing controlled material-removal operations on workpieces having varying geometries and physical properties. The apparatus comprises a machining table (100), an adjustable hydraulic vice (200), a laser generating unit (300) mounted on a vertically displaceable hydraulic stand (400), an assist gas unit (500), a controller (600), and an electric power source module. The hydraulic vice (200) employs independently vertically displaceable hydraulic actuators (204, 208) supporting parallel horizontal bars (202, 206) with sliding clamp members (210, 212) for securely positioning the workpieces. The laser generating unit (300) comprises multiple pump laser diodes (302), a laser pump combiner (306), a Ytterbium-doped active fiber amplifier (308), a laser beam delivery passive fiber (310), a galvo-mirror (312), and an F-Theta lens (314). A sensor module (800) comprising a thermal camera (802) and a proximity sensor (804) monitors operating conditions of the workpiece. Based on user-specified material-removal requirements and monitored operating conditions, the controller (600) determines the material thickness to be removed and selectively activates or deactivates the pump laser diodes to generate a corresponding laser beam, thereby enabling adaptive and precise laser-based material-removal operations. Fig. 2

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