MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202517082323 A) filed by Ohashi Engineering Co. , Ltd. on August 29, 2025, for Mounting Apparatus.
Inventors include Kashitani, Hisayoshi; Tomita, Akira; Kondo, Tsuyoshi; Nakamura, Makoto; and Suzuki, Shinji.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: Provided is a mounting apparatus with which it is possible to enhance reliability in mounting by checking a situation, in which a workpiece is bonded via thermal compression during manufacturing, from a viewpoint that is different from that of a thermal sensor provided to a heater. A controller (7) of a mounting apparatus (1) comprises: an application information acquisition unit (11) for acquiring a timing at which a pressure application unit applies pressure to a workpiece (100) by using a mounting tool (5) and application information regarding an electric power to be applied to a heater (4) by a heater control unit (6); an application amount calculation unit (12) for calculating a no-load application amount per a prescribed time, calculating a compression bonding application amount during a pressure application time from a first time (T1) to a second time (T2), which is calculated from the application information and the pressure application time acquired by the application information acquisition unit (11) in a state in which the pressure application unit applies pressure to the workpiece (100), and calculating a compression bonding discharge application amount by subtracting, from the compression bonding application amount, the value of the no-load application amount during a time corresponding to the pressure application time; and a determination unit (16) for determining whether the compression bonding discharge application amount is within a prescribed range.
Disclaimer: Curated by HT Syndication.
