MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202617081381 A) filed by Jfe Steel Corporation on July 01, 2026, for Mold Copper Plate, Mold For Continuous Casting, And Continuous Steel Casting Method.
Inventors include Furumai Kohei; and Goto Hikaru.
The application for the patent was published on August 28, 2026, under issue no. 35/2026.
Abstract: Provided is a mold copper plate that can suppress vertical cracks on the surface of a slab by suppressing uneven solidification of a solidified shell and extend the life of a mold for continuous casting. The mold copper plate used in a mold for continuous casting has: a base material layer containing copper or a copper alloy; a layer provided on the base material layer and including a recessed groove or a round groove; and a coating layer provided on the layer including the recessed groove or the round groove. The coating layer contains at least one among nickel, cobalt, a nickel base alloy, a cobalt base alloy, a stainless alloy, a metal nitride, a metal carbide, and a metal oxide. The layer including the recessed groove or the round groove is composed of a different material having a thermal conductivity that is at most 80% or at least 120% of the thermal conductivity of the base material layer.
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