MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202647069599 A) filed by Towa Corporation on June 03, 2026, for Mold, Resin Molding Device, And Method For Producing Resin Molded Article.
Inventor includes Kitahara Koichi.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: A mold (C) is provided with a first mold (LM) in which an object to be molded (Sa) is disposed and a second mold (UM) that is disposed facing the first mold (LM) and holds a release film (F) on a facing surface (33) that faces the first mold (LM). A cavity (MC) and excess resin storage cavities (11a, 12) are formed in at least one of the first mold (LM) and the second mold (UM). The second mold (UM) has: a movable member (14a) capable of advancing movement from a cavity inner surface (12b) into the excess resin storage cavities (11a, 12) and withdrawing movement of withdrawing from the inside of the surplus resin storage cavities (11a, 12); and a protruding part (15a) formed on at least a part of the periphery of the movable member (14a) and protruding from the cavity inner surface (12b) toward the inside of the excess resin storage cavities (11a, 12).
Disclaimer: Curated by HT Syndication.
