MUMBAI, India, Sept. 7 -- Intellectual Property India has published a patent application (202623090723 A) filed by Senti Technologies Private Limited on July 25, 2026, for Modular Stackable Sensor Platform.
Inventor includes Chothani, Prashant Madhusudan.
The application for the patent was published on September 04, 2026, under issue no. 36/2026.
Abstract: A modular stackable sensor platform (100) incorporates a host node (102), encompassing a microcontroller (102A) for processing sensor data, a wireless transceiver (102B) for communication, a primary battery (102C) for power supply and failover, and a primary plurality of electrical contacts (102D) to connect with passive sensor modules (104) that occupies intermediate positions and contains at least one sensing element (104A), a third plurality of electrical contacts (104B) on both proximal and distal surfaces, and a pass-through electrical path (104C) for conducting power and data between the host node (102) and an auxiliary battery pod (106). The auxiliary battery pod (106), located distally, houses a secondary battery (106A) and secondary plurality of electrical contacts (106B) to connect with the outermost passive sensor module (104). Upon removal of the auxiliary battery pod (106), the primary battery (102C) ensures uninterrupted operation of the sensing element (104A).
Disclaimer: Curated by HT Syndication.
