MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202521025222 A) filed by Meril Corporation I Private Limited on March 20, 2025, for Modular Implant Device For Femoral Head Replacement.
Inventors include Kansal, Siddhant; Kv, Latheesh; Tandel, Chirag; Shah, Naman; and Chunawala, Harshil.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: The present disclosure relates to a modular implant device (100) for femoral head replacement, comprising a modular femoral head (101) with a first interface surface (202), a second interface surface (203), and a third interface surface (204). The device further includes a metal sleeve (102) configured to mate with the modular femoral head (101) and a femoral stem (103). The metal sleeve (102) has a first mating surface (206), a second mating surface (207), and a third mating surface (208) adapted to correspondingly interface with the first, second, and third interface surfaces (202, 203, 204) of the modular femoral head (101), and a fourth mating surface (209) configured to mate with the femoral stem (103). There are three different metal sleeve (102) provided for each offset options, allowing for varying spatial positioning of the modular femoral head (101) relative to the femoral stem (103), enabling customization based on patient anatomy.
Disclaimer: Curated by HT Syndication.
