MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202611062794 A) filed by Maharishi Markandeshwar Deemed To Be University on May 18, 2026, for Miniaturized Multi-Sensor Micro-Probe For In-Situ Monitoring Of Rock Fracture Network Dynamics.
Inventors include Er. Parveen Kumar; and Dr. Chadetrik Rout.
The application for the patent was published on July 17, 2026, under issue no. 29/2026.
Abstract: MINIATURIZED MULTI-SENSOR MICRO-PROBE FOR IN-SITU MONITORING OF ROCK FRACTURE NETWORK DYNAMICS The invention relates to an in-situ temperature-stress micro-probe (ITSMP) configured for deployment within natural or induced fractures in rock formations. The ITSMP comprises a miniaturized, dart-shaped probe body having a tapered distal end for insertion into fracture apertures and one or more passive mechanical anchoring elements configured to engage fracture surfaces and secure the probe without the use of adhesives, grout, or external fixation mechanisms. The probe integrates multiple sensing elements including at least one strain sensor, at least one temperature sensor, and at least one pore pressure sensor for monitoring fracture-scale geomechanical and thermal conditions. The ITSMP further includes a low-power microcontroller and a wireless communication module configured to transmit sensor data through a multi-hop mesh network to surface-based or borehole-mounted receivers. In some embodiments, the probe includes an energy harvesting module for autonomous operation using vibration, thermal gradients, or strain energy, thereby enabling long-term deployment. The invention enables distributed, real-time monitoring and spatial characterization of fracture networks with improved resolution compared to conventional borehole-based instrumentation systems.
Disclaimer: Curated by HT Syndication.
